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Packaged Parts Test and Burn-in Solutions

Tahoe and Sonoma

The Tahoe and Sonoma solutions provide flexibility for the test/burn-in of packaged semiconductor devices. The Tahoe system provides slot-level power, stimulus, test and thermal management for low- to medium-power devices supported on Burn-in Boards (BIBs) that are compatible with many BIB loader/unloaders in the market today. The Sonoma system is the high-power solution for devices up to 2000W, with the power, stimulus, and test electronics localized to each device under test.

Tahoe

A flexible, modular system for test and burn-in of low- to medium-power logic devices
  • More DUTs per System
    • Larger BIBs – up to 457mm x 610mm
    • Up to 24 BIBs per system
    • Individual Socket Thermal Control or Chamber Temperature Control
  • Up to 688W per BIB
  • Production Ready
    • Multi-step test plans
    • GUI front end for easy user engagement
    • Full lot management with auto adjusting due dates
  • Better Chamber
    • Better Airflow and Temperature Uniformity
    • Small System Footprint

Sonoma

A high-power system for AI and HPC applications
  • High power
    • More Reliable Power and Stimulus delivery
    • Localized power supplies and stimulus controller for better signal integrity
  • Production Ready
    • Multi-step test plans
    • GUI front end for easy user interaction
    • No BIM removal required for device load/unload
  • Thermal Management
    • Liquid-cooled or air-cooled options
    • Up to 2000W per device
    • Up to 22 slots per system
    • Individual socket thermal control

Automated BIB Loader

Automated Burn-In Board (BIB) loading and unloading solution
  • Multiple Burn-in Boards (BIBs) input and Output
  • Trolleys Available for Transport of BIBs to/from Burn-in System and Loader/Unloader
  • Device Input and Output Using JEDEC Tray Stacks (Other Types of Trays Also)
  • Pass/Fail Sorting of Devices
  • Very High Throughput Using Pick and Place of Multiple Devices at Once
  • Fast Change-over for Different Devices
  • Open Top or Lidded Device Sockets
  • Very High Reliability

Tahoe Burn-in Boards

Boards used to hold and connect one or more Devices Under Test (DUTs) to the power and test resources of the Tahoe system
  • Economical BIB Format
    • Economical PC Fab Size
    • Card-edge Connector Interface
      • No Connector Cost
    • Non-proprietary Interface
      • No License Fees
  • BIB size 17.7”x 22.4” (450 mm x 570 mm)

Sonoma Burn-in Modules

Burn-in modules used to hold and connect high power devices under test to the power and test resources of the Sonoma system
  • Up to 2000 watts per device
  • Up to 128 bi-directional (IO) digital channels
  • Up to 25 Mhz vector clock
  • Individual temperature control and monitoring
  • Liquid cooled or air-cooled options