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Multi Wafer Test and Burn-in Solutions

FOX-XP

The FOX-XP solution is a highly flexible test/burn-in solution which can be configured to support WaferPak Contactors for full wafer test. An optional FOX-XP WaferPak Aligner is available for aligning wafers into FOX WaferPak Contactors to increase throughput.

FOX-XP

Multi Wafer & Singulated Die / Module Test System

High Throughput Burn-in and Test Solution for Logic/Memory/Photonic Devices
  • Flexible Solution for High Throughput Burn-in and Test
    • Full wafer / panel / singulated die / module burn-in for highest production throughput
    • Improves yield of logic/memory/photonic die before final package integration
    • High volume production capacity – up to 18 wafers or panels using WaferPak™ cartridges or 9 singulated die/module DiePak® carriers per chamber
  • Cost-Effective Solution Designed for High Volume Burn-in/Production Test
    • Configurable channel resources per Blade (slot): Universal Channel Modules, High Voltage Channel Modules or High Current Channel Modules
    • Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) per Blade with deep scan, pattern data and capture memory per channel for test of devices with BIST/DFT
    • Up to 1,024 high voltage (29V) or high current (4A) sources resources per Blade
  • Production Proven Full-Wafer Burn-in & Test Solution
    • Reduces test costs by functionally testing wafers/die/modules during burn-in
    • Offers a total burn-in and test solution when configured with a WaferPak contactor / DiePak carrier and Wafer Aligner / DiePak Loader
    • Protects devices with individual per channel over-current and over-voltage protection

Automated FOX-XP WaferPak Aligner

Wafer Loader/Unloader for FOX WaferPak Contactors

  • Automated Solution for Loading, Aligning and Unloading of Wafers
    • Loads and unloads wafers between FOUPs or cassettes and WaferPak contactors
    • Dual FOUP/cassette interface enables automated handling of up to 50 wafers
    • Handles and aligns up to 300 mm wafer sizes
    • May be used with a FOX-XP or FOX-15 System
  • Precision Wafer Handling and Pad to Probe Alignment
    • Optical alignment via multiple cameras assures correct wafer to probe alignment and placement in a WaferPak contactor
  • Production Proven Full-Wafer Burn-in & Test Solution
    • Based upon an industry-leading wafer prober platform
    • Optical bar code reading of FOUPs, Wafer IDs and WaferPak contactor IDs for error free operation and wafer traceability
    • May be integrated with a factory automated material handling systems
  • Integrated Solution with FOX-XP system
    • Enables automated selection of test program based on device/lot ID
    • Shares traceability of devices and test results with FOX-XP system

FOX-XP WaferPak Contactor

Single Touchdown Full-Wafer Test & Burn-in

  • Delivers FOX-XP system resources to the wafer enabling single touchdown test and burn-in
    • May be designed for up to 300 mm wafer sizes
    • Production proven with > 50,000 contacts per wafer
    • Pad Metallurgy: Al, Cu, Au or solder balls
    • Temperature range: Ambient to 150° C
  • Supports up to 2,048 I/O and DPS channels with remote voltage and ground sense per pin
    • Handles up to 4 amps per contact
  • Handles up to 2 kW of power dissipation
  • Enables high volume full wafer production test and burn-in with one touchdown
  • Field repairable carrier