FOX-XP
The FOX-XP solution is a highly flexible test/burn-in solution which can be configured to support DiePak Carriers for singulated die/module test. An optional automated DiePak Loader is available for loading/unloading devices into FOX DiePak Carriers to increase throughput.
FOX-XP
Full Wafer & Singulated Die / Module Test System
High Throughput Burn-in and Test Solution for Logic/Memory/Photonic Devices
- High Throughput Reliability Verification and Test System for Volume Production
- Handles full wafers / panels / singulated die / modules for highest production throughput
- Identifies failing logic / memory / photonic die before final package integration
- High power system with up to 18 Blades (slots) for wafer or panel testing using WaferPakTM
contactors or 9 Blade capability for singulated die / module DiePak® carriers
- Configurable Channel Resources
- Multiple resource modules available per Blade (slot): Universal Channel Modules, High Voltage
Channel Modules or High Current Channel Modules - Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) per Blade with deep
scan, pattern data and capture memory per channel for test of devices with BIST/DFT - Up to 1,024 high voltage (29V) or high current (2A) sources resources per Blade
- Multiple resource modules available per Blade (slot): Universal Channel Modules, High Voltage
- Production Proven Full-Wafer Reliability Verification & Test Solution
- Reduces test costs by functionally testing wafers/die/modules during reliability verification
- Offers a total solution when configured with a WaferPak contactor / DiePak carrier and Wafer
Aligner / DiePak Loader -
Protects devices with individual per channel over-current and over-voltage protection
FOX-NP
Full Wafer & Singulated Die / Module Test System
Compact High Power Test and Reliability Verifications Solution for Logic/Memory/Photonic Devices
- Compact Flexible Solution for High Throughput Reliability Verification and Test
- Handles full wafer / panel / singulated die / module applications
- Identifies failing logic/memory/photonic die before final package integration
- High power thermal chuck dual Blade (slot) capability using WaferPak™ contactors or DiePak®
carriers (for singulated die/modules)
- Cost-Effective Solution for High Power Wafer/Die/Module Verification and Test
- Configurable channel resources per Blade (slot): Universal Channel Modules, High Voltage
Channel Modules or High Current Channel Modules - Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) per Blade with deep
scan, pattern data and capture memory per channel for test of devices with BIST/DFT - Up to 1,024 high voltage (29 V) or high current (2 A) sources resources per Blade
- Configurable channel resources per Blade (slot): Universal Channel Modules, High Voltage
- Production Proven Full-Wafer Reliability Verification & Test Solution
- Reduces test costs by functionally testing wafers/die/modules during reliability verification
- Offers a total solution when configured with a WaferPak contactor / DiePak carrier and Wafer
Aligner / DiePak Loader -
Protects devices with individual per channel over-current and over-voltage protection
Automated DiePak Loader
Device Loader/Unloader for FOX DiePak Carriers
- Automated Solution for Loading and Unloading Modules & Singulated Die
- Loads and unloads devices between JEDEC trays and DiePak carriers
- Handles: QFN, CSP, QFP, TSOP, BGA and EMMC devices
- Contains JEDEC bin trays for device test sorting
- Precision Socket Loading/Unloading
- Precision alignment ensured with DiePak carrier specific alignment kit designed for handling device to socket alignment and placement in a DiePak carrier
- Production Proven Full-Wafer Burn-in & Test Solution
- Based upon an industry-leading pick and place handler design
- Optical bar code reading of JEDEC tray, DiePak carrier and device IDs for error free operation and device traceability
-
Includes a DiePak Trolley for easy loading of DiePak carriers into the FOX-XP system
- Integrated Solution with FOX-XP system
- Enables automated selection of test program based on device/lot ID
- Shares traceability of devices and test results with FOX-XP system
FOX DiePak Carrier
Singulated Die / Module Test & Burn-in
- Delivers FOX-XP system resources to up to 1,024 singulated die / modules per DiePak carrier, enabling high density test and burn-in
- Supports up to 2,048 I/O and DPS channels with remote voltage and ground sense per pin
- DiePak sockets are custom designed per application by Aehr Test to ensure electrical performance and burn-in temperature stability
- Optional optical measurement capability incorporated into each socket
- Handles up to 2 kW of power dissipation per DiePak Carrier
- Temperature range: Ambient to 150° C
- Field repairable carrier