ARTIFICIAL INTELLIGENCE
Powerful Test Solutions for Advancing Al and Complex Computing Applications
- Effectively addresses the unique challenges and increasing demands for high-power AI processors
- Complete, turn-key reliability and testing from engineering to high volume production
- Robust and efficient burn-in processes eliminate the potential for critical failures in real-world application
- Industry-leading hardware and software architecture with highly proven performance
Featured Applications:
AUTOMOTIVE
IC growth driving increasing quality and reliability requirements
- IC growth in sensors, control, information and entertainment driving higher quality and reliability requirements
- Full wafer functional, stress and burn-in testing solutions
- Automotive and military grade testing
- Complete production solution for testing collision detection sensors, e.g. LIDAR
- High volume production of power electronics, e.g. SiC, GaN
Featured Applications:
Mobile
Cutting edge industrial design driving smallest, multi-function devices
- Need for differentiated product driving unique and cutting edge features like 3D and optical sensors
- Industrial Design driving smaller, multi-function packaged parts pushing test towards Known-Good Die and wafer level burn-in
- Mobile shake and shock driving higher initial reliability and long term ruggedness
- Unit sales in the 10s of millions driving the need for cost effective test that meets DPPM quality requirements
Featured Applications:
Silicon Photonics
Light sensing during test and burn-in
- Growing 3D and optical sensing applications driving the need for illuminators and optical sensors
- VCSEL / LED early lifetime failure curve driving high value bathtub curve production testing
- Unique optical sensing, high power and thermal management solution for optical modules at die and packaged part level
- Cost effective upstream testing at wafer, die level or of multi-function parts
Featured Applications:
MEMORY AND LOGIC
High parallelism solutions for HVM
Silicon Carbide
Leader in Silicon Carbide Die Stress Testing
- Silicon Carbide (SiC) a wide-bandgap semiconductor can operate at substantially higher temperatures, voltages, and power levels than silicon-based semiconductor
- SiC technology enables smaller, lighter, and simpler electrical systems
- SiC is an ideal material for a broad range of applications such as electric vehicles, and 5G cellular technology
- Unique Cost of Test (COT) and scalable SiC solutions in high volume production
Featured Applications: