Fremont, CA (November 15, 2021) – Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced that President and CEO Gayn Erickson and CFO Ken Spink will be participating in the 10th Annual December CEO Summit taking place December 8, 2021 at the St. Regis Hotel in San Francisco. The conference is being held concurrently with SEMICON West 2021 and is an in-person event. The presentation material utilized at the CEO Summit will be made available on the investor relations page of the Company’s website at www.aehr.com.

About the 10th Annual December CEO Summit 2021

The December CEO Summit is collectively hosted by the executive management teams from 11 participating companies and features a “round-robin” format consisting of small group meetings.

Held concurrently with SEMICON West in San Francisco, this CEO Summit is a live event. The St. Regis Hotel, SEMICON West, and therefore the CEO Summit, all require proof of COVID vaccination in order to register and attend events in person.

The 11 management teams currently confirmed to host the December 2021 CEO Summit are: ACM Research (ACMR), Aehr Test (AEHR), Alpha & Omega Semiconductor (AOSL), Axcelis (ACLS), Cohu (COHU), Ichor Systems (ICHR), inTEST Corporation (INTT), Kulicke & Soffa (KLIC), Onto Innovation (ONTO), Pivotal Systems (PVS.AX), and Revasum (RVS.AX).

The CEO Summit is by invitation only and is open to accredited investors and publishing research analysts. Please RSVP early, given the logistical considerations of live event registration this year, as well as space limitations. Hosts reserve the right to limit attendance as necessary. Last day for registration is November 29th, 2021.

RSVP Contacts for 10th Annual December CEO Summit

To RSVP for the CEO Summit, please contact either of the Summit’s co-chairs.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTS^TM and FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX-XP WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost single-wafer compact test and reliability verification solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The WaferPak Contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.